Multiscene FPGA Integrated Circuit Surface Mount XC7K325T-2FFG900I 500 I/O
Contact me for free samples and coupons.
Whatsapp:0086 18588475571
Wechat: 0086 18588475571
Skype: sales10@aixton.com
If you have any concern, we provide 24-hour online help.
xNumber Of LABs/CLBs | 25475 | Number Of Logic Elements/Cells | 326080 |
---|---|---|---|
Total RAM Bits | 16404480 | Number Of I/O | 500 |
Number Of Gates | - | Voltage - Supply | 0.97V ~ 1.03V |
Mounting Type | Surface Mount | Operating Temperature | -40°C ~ 100°C (TJ) |
Package / Case | 900-BBGA, FCBGA | Supplier Device Package | 900-FCBGA (31x31) |
Highlight | Multiscene FPGA Integrated Circuit,FPGA Integrated Circuit Surface Mount,XC7K325T-2FFG900I |
XC7K325T-2FFG900I IC FPGA 500 I/O 900FCBGA AMD
Product Details
XC7K325T-2FFG900I Description
The Xilinx Kintex®-7 FPGA family provide your designs with the best price/performance/watt at 28nm while giving you high DSP ratios, cost effective packaging and support for mainstream standards like PCIe® Gen3 and 10gigabit Ethernet. Optimized for best price-performance with a 2X improvement compared to previous generation enabling a new class of FPGAs. It features up to 478K logic cells, 34Mb block RAM, 1920 DSP slices, 2845 GMAC/s DSP performance, 32 transceivers, 12.5Gb/s transceiver speed, 800Gb/s serial bandwidth, x8 Gen2 PCIe interface, 500 I/O pins, VCXO component, advanced extensible interface 4 (AXI4) IP, agile mixed signal (AMS) integration and 1.2 to 3.3V I/O voltage. The Kintex®-7 family ideal for applications including 3G and 4G wireless, flat panel displays and video over IP solutions.
XC7K325T-2FFG900I Features
-3, -2, -1, -1L, -2L speed grade options with 0 to 85°C/0°C to 100°C/-40°C to 100°C temperatures
Programmable system integration, increased system performance, BOM cost reduction
Total power reduction (50% lower power than previous generation 40nm devices)
Accelerated design productivity, scalable optimized architecture, comprehensive tools and IP
State-of-the-art, high performance, low power (HPL), 28nm, high-k metal gate (HKMG) technology
Powerful clock management tiles combining phase-locked loop and mixed-mode clock manager blocks
Lidless flip chip and high performance flip-chip package options
Kintex®-7 FPGA provides high speed serial connectivity with built-in multi gigabit transceivers
User configurable analogue interface (XADC), real 6-input lookup table (LUT) technology
High performance SelectIO™ technology with support for DDR3 interfaces up to 1866Mb/s
Specifications
Attribute | Attribute Value |
---|---|
Manufacturer | Xilinx |
Product Category | FPGAs (Field Programmable Gate Array) |
Series | Kintex-7 |
Package-Case | 900-BBGA, FCBGA |
Operating-Temperature | -40°C ~ 100°C (TJ) |
Mounting-Type | Surface Mount |
Voltage-Supply | 0.97 V ~ 1.03 V |
Supplier-Device-Package | 900-FCBGA (31x31) |
IC Number of Gates | - |
Number-of-I-O | 500 I/O |
Number-of-LABs-CLBs | 25475 |
Number-of-Logic-Elements-Cells | 326080 |
Total-RAM-Bits | 16404480 Bits |
Mfr | AMD Xilinx |
Series | Kintex®-7 |
Package | Tray |
Product-Status | Active |
Total-RAM-Bits | 16404480 |
Number-of-I-O | 500 |
Voltage-Supply | 0.97V ~ 1.03V |
Package-Case | 900-BBGA FCBGA |
Base-Product-Number | XC7K325 |