Multiscene FPGA Integrated Circuit Surface Mount XC7K325T-2FFG900I 500 I/O

Brand Name AMD
Model Number XC7K325T-2FFG900I
Minimum Order Quantity 1
Price Based on current price
Packaging Details anti-static bag & cardboard box
Delivery Time 3-5 work days
Payment Terms T/T
Supply Ability In stock

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Product Details
Number Of LABs/CLBs 25475 Number Of Logic Elements/Cells 326080
Total RAM Bits 16404480 Number Of I/O 500
Number Of Gates - Voltage - Supply 0.97V ~ 1.03V
Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 900-BBGA, FCBGA Supplier Device Package 900-FCBGA (31x31)
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Multiscene FPGA Integrated Circuit

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FPGA Integrated Circuit Surface Mount

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XC7K325T-2FFG900I

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Product Description

XC7K325T-2FFG900I IC FPGA 500 I/O 900FCBGA AMD

Product Details

XC7K325T-2FFG900I Description

The Xilinx Kintex®-7 FPGA family provide your designs with the best price/performance/watt at 28nm while giving you high DSP ratios, cost effective packaging and support for mainstream standards like PCIe® Gen3 and 10gigabit Ethernet. Optimized for best price-performance with a 2X improvement compared to previous generation enabling a new class of FPGAs. It features up to 478K logic cells, 34Mb block RAM, 1920 DSP slices, 2845 GMAC/s DSP performance, 32 transceivers, 12.5Gb/s transceiver speed, 800Gb/s serial bandwidth, x8 Gen2 PCIe interface, 500 I/O pins, VCXO component, advanced extensible interface 4 (AXI4) IP, agile mixed signal (AMS) integration and 1.2 to 3.3V I/O voltage. The Kintex®-7 family ideal for applications including 3G and 4G wireless, flat panel displays and video over IP solutions.


XC7K325T-2FFG900I Features

-3, -2, -1, -1L, -2L speed grade options with 0 to 85°C/0°C to 100°C/-40°C to 100°C temperatures
Programmable system integration, increased system performance, BOM cost reduction
Total power reduction (50% lower power than previous generation 40nm devices)
Accelerated design productivity, scalable optimized architecture, comprehensive tools and IP
State-of-the-art, high performance, low power (HPL), 28nm, high-k metal gate (HKMG) technology
Powerful clock management tiles combining phase-locked loop and mixed-mode clock manager blocks
Lidless flip chip and high performance flip-chip package options
Kintex®-7 FPGA provides high speed serial connectivity with built-in multi gigabit transceivers
User configurable analogue interface (XADC), real 6-input lookup table (LUT) technology
High performance SelectIO™ technology with support for DDR3 interfaces up to 1866Mb/s

Specifications

Attribute Attribute Value
Manufacturer Xilinx
Product Category FPGAs (Field Programmable Gate Array)
Series Kintex-7
Package-Case 900-BBGA, FCBGA
Operating-Temperature -40°C ~ 100°C (TJ)
Mounting-Type Surface Mount
Voltage-Supply 0.97 V ~ 1.03 V
Supplier-Device-Package 900-FCBGA (31x31)
IC Number of Gates -
Number-of-I-O 500 I/O
Number-of-LABs-CLBs 25475
Number-of-Logic-Elements-Cells 326080
Total-RAM-Bits 16404480 Bits
Mfr AMD Xilinx
Series Kintex®-7
Package Tray
Product-Status Active
Total-RAM-Bits 16404480
Number-of-I-O 500
Voltage-Supply 0.97V ~ 1.03V
Package-Case 900-BBGA FCBGA
Base-Product-Number XC7K325

Descriptions

IC FPGA 500 I/O 900FCBGA